BAV3004W_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT LOW LEAKAGE DIODE

BAV3004W
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
Mechanical Data
• Surface Mount Package Ideally Suited for Automated Insertion
• Low Leakage Current
• Fast Switching Speed
• High Reverse Breakdown Voltage
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 1 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
• Case: SOD-123
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free plating (Matte Tin Finish annealed over Alloy 42
leadframe)
• Polarity: Cathode Band
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
SOD-123
TOP VIEW
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
V_RRM
350
V
Working Peak Reverse Voltage
DC Blocking Voltage
V_RWM
300
V
V_R
RMS Reverse Voltage
V_R(RMS)
212
V
Forward Continuous Current
I_FM
225
mA
Repetitive Peak Forward Current
I_FRM
625
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
I_FSM
4.0
1.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 3)
Thermal Resistance Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J , T_STG
Value
400
312
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min
V_(BR)R
350
V_FM
⎯
I_RM
⎯
C_T
⎯
t_rr
⎯
Typ
⎯
⎯
0.78
0.93
1.03
30
35
1.0
⎯
Max
⎯
⎯
0.87
1.0
1.25
100
100
5.0
50
Unit
V
V
nA
μA
pF
ns
Test Condition
I_R = 150μA
I_F = 20mA
I_F = 100mA
I_F = 200mA
V_R = 240V, T_J = 25°C
V_R = 240V, T_J = 150°C
V_R = 0, f = 1.0MHz
I_F = I_R = 30mA,
I_rr = 3.0mA, R_L = 100Ω
Notes:
1. No purposefully added lead. Halogen and Antimony Free.
2. Short duration pulse test used to minimize self-heating effect.
3. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
BAV3004W
Document number: DS30371 Rev. 11 - 2
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated