BAT40V_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS

Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free by Design/RoHS Compliant (Note 1)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 4 and 5)
BAT40V
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
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Mechanical Data
• Case: SOT-563, Molded Plastic
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Finish – Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Terminals: Lead Bearing Terminal Plating available.
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
C₁ NC C₂
Top View
Bottom View
A₁ NC A₂
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
40
V
V_R
Forward Continuous Current
(Note 2)
I_F
200
mA
Repetitive Peak Forward Current
(Note 2)
I_FRM
350
mA
Forward Surge Current
(Note 2)
@ tp =10ms
I_FSM
750
mA
Thermal Characteristics
Power Dissipation
Characteristic
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 2)
(Note 2)
Symbol
P_D
R_θJA
T_J, T_STG
Value
150
833
-65 to +125
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage
Forward Voltage
Reverse Leakage Current
Total Capacitance
Reverse Recovery Time
Symbol Min
(Note 3) V_(BR)R
40
V_F
⎯
(Note 3)
I_R
⎯
C_T
⎯
t_rr
⎯
Typ Max Unit
Test Condition
⎯
⎯
V I_R = 100μA
330
I_F = 2.0mA
⎯
420
800
mV ^{IF = 15mA}
I_F = 100mA
1000
I_F = 200mA
⎯ 500 nA V_R = 25V
⎯
10
pF V_R = 1.0V, f = 1.0MHz
⎯
5.0
ns ^{IF = 10mA through IR = 10mA}
to I_R = 1.0mA, R_L = 100Ω
Notes:
1. No purposefully added lead.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. T_A = 25°C.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAT40V
Document number: DS30533 Rev. 7 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated