BAT40VC Datasheet, PDF (1/2 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS

SPICE MODEL: BAT40VC
Lead-free Green
BAT40VC
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and
ESD Protection
• Lead Free by Design/RoHS Compliant (Note 1)
• "Green" Device (Note 4)
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Ordering: See Page 2
• Marking & Type Code Information: See last page
• Weight: 0.003 grams (approximate)
A
BC
D
G
K
H
M
L
C₁ NC C₂
A₁ NC A₂
SOT-563
Dim Min Max Typ
A 0.15 0.30 0.25
B 1.10 1.25 1.20
C 1.55 1.70 1.60
D
0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
K 0.56 0.60 0.60
L 0.10 0.30 0.20
M 0.10 0.18 
All Dimensions in mm
Maximum Ratings ^{@ TA = 25°C unless otherwise specified}
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 2)
Repetitive Peak Forward Current (Note 2)
Forward Surge Current (Note 2)
@ tp =10ms
Operating and Storage Temperature Range
Symbol
V_RRM
V_RWM
VR
I_F
IFRM
I_FSM
Tj, TSTG
Value
40
200
350
750
-65 to +125
Unit
V
mA
mA
mA
°C
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Reverse Breakdown Voltage (Note 3)
Symbol Min Typ
V_(BR)R
40

Forward Voltage (Note 3)
Reverse Leakage Current (Note 3)
Total Capacitance
Reverse Recovery Time
VF


I_R


CT


trr


Max

330
420
800
1000
500
10
5.0
Unit
Test Condition
V IR = 100µA
IF = 2.0mA
mV
I_F = 15mA
I_F = 100mA
IF = 200mA
nA VR = 25V
pF VR = 1.0V, f = 1.0MHz
ns
I_F = 10mA through I_R = 10mA
to I_R = 1.0mA, R_L = 100Ω
Thermal Characteristics ^{@ TA = 25°C unless otherwise specified}
Characteristic
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air (Note 3)
Symbol
Pd
R_θJA
Value
150
833
Notes:
1. No purposefully added lead.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration test pulse used to minimize self-heating effect.
4. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
Unit
mW
°C/W
DS30637 Rev. 3 - 2
1 of 2
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BAT40VC
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