BAS70W_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

SPICE MODELS: BAS70W BAS70W-04 BAS70W-05 BAS70W-06
Lead-free Green
BAS70W/ -04/ -05/ -06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
· Low Turn-on Voltage
· Fast Switching
· PN Junction Guard Ring for Transient and ESD Protection
· Ultra-Small Surface Mount Package
· Lead Free/RoHS Compliant (Note 3)
· "Green" Device (Note 4 and 5)
Mechanical Data
A
BC
· Case: SOT-323
G
· Case Material: Molded Plastic, "Green" Molding Compound,
H
Note 5. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
K
· Terminals: Solderable per MIL-STD-202, Method 208
· Lead Free Plating (Matte Tin Finish annealed over Alloy 42 ^J
leadframe).
DE
L
· Polarity: See Diagrams Below
· Marking: See Diagrams Below & Page 3
· Weight: 0.006 grams (approximate)
TOP VIEW
SOT-323
Dim Min Max
A
0.25 0.40
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
E
0.30 0.40
G
1.20 1.40
H
1.80 2.20
M
J
0.0 0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.18
a
0°
8°
All Dimensions in mm
BAS70W Marking: K73
BAS70W-04 Marking: K74 BAS70W-05 Marking: K75 BAS70W-06 Marking: K76
Maximum Ratings and Electrical Characteristics, Single Diode ^{@ TA = 25°C unless otherwise specified}
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t_p < 1.0s
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
Storage Temperature Range
Symbol
V_RRM
V_RWM
VR
V_R(RMS)
I_F
IFSM
P_d
R_qJA
T_j
T_STG
Value
70
49
70
100
200
625
-55 to +125
-65 to +150
Unit
V
V
mA
mA
mW
°C/W
°C
°C
Electrical Ratings ^{@ TA = 25°C unless otherwise specified}
Characteristic
Symbol Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
V_(BR)R
70
V_F
—
I_R
¾
C_T
¾
t_rr
—
—
410
1000
100
2.0
5.0
—
I_R = 10mA
mV
tp <300µs, IF = 1.0mA
t_p <300µs, I_F = 15mA
nA
t_p < 300µs, V_R = 50V
pF
VR = 0V, f = 1.0MHz
ns
IF = IR = 10mA to IR = 1.0mA,
Irr = 0.1 x I_R, R_L = 100W
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30113 Rev. 11 - 2
1 of 3
BAS70W/ -04/ -05/ -06
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