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BAS70TW_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
BAS70TW /DW-04 /DW-05 /DW-06 /BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
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Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Orientation: See Diagrams Below
• Marking Information: See Page 3
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
AC
1
C1
C2
AC
C2
A2
1
C1
A2
A2
A1
C2
C2
C1
C2
C3
Top View
A1
A2
AC
2
BAS70BRW
*Symmetrical configuration, no orientation indicator.
A1
C1
AC
2
BAS70DW-04*
A1
A1
C2
BAS70DW-05*
C1
C1
A2
BAS70DW-06*
A1
A2
A3
BAS70TW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
VRRM
Working Peak Reverse Voltage
DC Blocking Voltage
VRWM
70
V
VR
RMS Reverse Voltage
VR(RMS)
49
V
Forward Continuous Current (Note 1)
IFM
70
mA
Non-Repetitive Peak Forward Surge Current
@ t < 1.0s
IFSM
100
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ
TSTG
Value
200
625
-55 to +125
-65 to +125
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol
Min
V(BR)R
70
VF
⎯
IR
⎯
CT
⎯
trr
⎯
Max
⎯
410
1000
100
2.0
5.0
Unit
V
mV
mV
nA
pF
ns
Test Condition
IR = 10μA
tp <300µs, IF = 1.0mA
tp <300µs, IF = 15mA
tp < 300µs, VR = 50V
VR = 0V, f = 1.0MHz
IF = IR = 10mA to IR = 1.0mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS70TW /DW-04
/DW-05 /DW-06 /BRW
Document number: DS30158 Rev. 12 - 2
1 of 3
www.diodes.com
July 2008
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