BAS70JW_15 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY

Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
BAS70JW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
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Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please see Ordering Information, Note 7, on Page 2
• Orientation: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
C₁
C₂
A₁
A₂
Top View
Device Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
70
V
V_R
RMS Reverse Voltage
V_R(RMS)
49
V
Forward Continuous Current (Note 1)
I_FM
70
mA
Non-Repetitive Peak Forward Surge Current
@ t < 1.0s
I_FSM
100
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
Storage Temperature Range
Symbol
P_D
R_θJA
T_J
T_STG
Value
200
625
-55 to +125
-65 to +125
Unit
mW
°C/W
°C
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol
Min
V_(BR)R
70
V_F
⎯
I_R
⎯
C_T
⎯
t_rr
⎯
Max
⎯
410
1000
100
2.0
5.0
Unit
V
mV
mV
nA
pF
ns
Test Condition
I_R = 10μA
t_p <300µs, I_F = 1.0mA
t_p <300µs, I_F = 15mA
t_p < 300µs, V_R = 50V
V_R = 0V, f = 1.0MHz
I_F = I_R = 10mA to I_R = 1.0mA,
I_rr = 0.1 x I_R, R_L = 100Ω
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS70JW
Document number: DS30188 Rev. 13 - 2
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated