BAS40_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features
• Low Forward Voltage Drop
• Fast Switching
• PN Junction Guard Ring for Transient and ESD Protection
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
BAS40 /-04 /-05 /-06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
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Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagrams Below
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
Top View
BAS40
BAS40-04
BAS40-05
BAS40-06
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 1)
Forward Surge Current (Note 1)
@ t < 1.0s
Symbol
V_RRM
V_RWM
V_R
I_FM
I_FSM
Value
40
200
600
Unit
V
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating Temperature Range
Storage Temperature Range
Symbol
P_D
R_θJA
T_J
T_STG
Value
350
357
-55 to +125
-65 to +150
Unit
mW
°C/W
°C
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min Typ
V_(BR)R
40
⎯
V_F
⎯
⎯
I_R
⎯ 20
C_T
⎯ 4.0
t_rr
⎯
⎯
Max
⎯
380
1000
200
5.0
5.0
Unit
Test Condition
V I_R = 10μA
mV ^{tp < 300μs, IF = 1.0mA}
t_p < 300μs, I_F = 40mA
nA t_p < 300μs, V_R = 30V
pF V_R = 0V, f =1.0MHz
ns ^{IF = IR = 10mA to IR = 1.0mA,}
R_L = 100Ω
Notes:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
BAS40 /-04 /-05 /-06
Document number: DS11006 Rev. 21 - 2
1 of 3
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July 2008
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