BAS40W_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT SCHOTTKY BARRIER DIODE

SPICE MODELS: BAS40W BAS40W-04 BAS40W-05 BAS40W-06
Lead-free Green
BAS40W/-04/-05/-06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
· Low Forward Voltage Drop
· Fast Switching
· Ultra-Small Surface Mount Package
· PN Junction Guard Ring for Transient and ESD Protection
A
· Lead Free/RoHS Compliant (Note 3)
C
· "Green" Device (Note 4 and 5)
Mechanical Data
BC
· Case: SOT-323
B
E
· Case Material: Molded Plastic, "Green" Molding
G
Compound, Note 4. UL Flammability Classification Rating
H
94V-0
K
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Solderable per MIL-STD-202, Method 208
J
· Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
DF
L
· Polarity: See Diagrams Below
· Marking: See Diagrams Below &Page 3
· Weight: 0.006 grams (approximate)
TOP VIEW
SOT-323
Dim Min Max
A
0.25 0.40
B
1.15 1.35
C
2.00 2.20
D
0.65 Nominal
E
0.30 0.40
G
1.20 1.40
H
1.80 2.20
M
J
0.0 0.10
K
0.90 1.00
L
0.25 0.40
M
0.10 0.18
a
0°
8°
All Dimensions in mm
BAS40W Marking: K43
BAS40W-04 Marking: K44
BAS40W-05 Marking: K45
BAS40W-06 Marking: K46
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t = 1.0s
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
Storage Temperature Range
Symbol
V_RRM
V_RWM
V_R
VR(RMS)
I_FM
IFSM
P_d
RqJA
T_j
TSTG
Electrical Characteristics ^{@ TA = 25°C unless otherwise specified}
Value
40
28
200
600
200
625
-55 to +125
-65 to +150
Unit
V
V
mA
mA
mW
°C/W
°C
°C
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol
Min
V_(BR)R
40
V_F
¾
I_R
¾
CT
¾
t_rr
¾
Max
¾
380
1000
200
5.0
5.0
Unit
V
mV
mV
nA
pF
ns
Test Condition
I_R = 10mA
I_F = 1.0mA, t_p < 300ms
IF = 40mA, tp < 300ms
VR = 30V
V_R = 0, f = 1.0MHz
IF = IR = 10mA,
I_rr = 0.1 x I_R, R_L = 100W
Notes:
1. Device mounted on FR4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30114 Rev. 12 - 2
1 of 3
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