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BAS21T_15 Datasheet, PDF (1/3 Pages) SeCoS Halbleitertechnologie GmbH – Plastic- Encapsulated Diode
Features
• Ultra-Small Surface Mount Package
• Fast Switching Speed
• For General Purpose Switching Applications
• High Conductance
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
BAS21T
SURFACE MOUNT FAST SWITCHING DIODE
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Mechanical Data
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SOT-523
Case: SOT-523
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Repetitive Peak Reverse Voltage
VRRM
250
V
Working Peak Reverse Voltage
DC Blocking Voltage
VRWM
200
V
VR
RMS Reverse Voltage
VR(RMS)
141
V
Forward Continuous Current (Note 1)
IFM
400
mA
Average Rectified Output Current (Note 1)
IO
200
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
IFSM
2.5
0.5
A
Repetitive Peak Forward Surge Current
IFRM
625
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current @ Rated DC Blocking Voltage (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min
V(BR)R
250
VF
⎯
IR
⎯
CT
⎯
trr
⎯
Max
⎯
1.0
1.25
100
15
5.0
50
Unit
V
V
nA
μA
pF
ns
Test Condition
IR = 100μA
IF = 100mA
IF = 200mA
TJ = 25°C
TJ = 100°C
VR = 0, f = 1.0MHz
IF = IR = 30mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS21T
Document number: DS30264 Rev. 10 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated