BAS20DW_09 Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT LOW LEAKAGE DIODE

BAS20DW-BAS21DW
SURFACE MOUNT LOW LEAKAGE DIODE
Please click here to visit our online spice models database.
Features
Mechanical Data
• Fast Switching Speed
• Surface Mount Package Ideally Suited for Automated Insertion
• High Reverse Breakdown Voltage
• Low Leakage Current
• Lead Free By Design/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
SOT-363
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_FM
I_O
I_FSM
I_FRM
BAS20DW
200
BAS21DW
Unit
250
V
150
200
V
106
141
V
400
mA
200
mA
2.5
0.5
A
625
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current
@ Rated DC Blocking Voltage (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min
BAS20DW
BAS21DW
V_(BR)R
200
250
V_F
⎯
I_R
⎯
C_T
⎯
t_rr
⎯
Max
⎯
⎯
1.0
1.25
100
15
5.0
50
Unit
V
V
nA
μA
pF
ns
Test Condition
I_R = 100μA
I_F = 100mA
I_F = 200mA
T_j = 25°C
T_j = 100°C
V_R = 0, f = 1.0MHz
I_F = I_R = 30mA,
I_rr = 0.1 x I_R, R_L = 100Ω
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS20DW-BAS21DW
Document number: DS30617 Rev. 10 - 2
1 of 4
www.diodes.com
May 2009
© Diodes Incorporated