BAS19_ Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT FAST SWITCHING DIODE

SPICE MODELS: BAS19 BAS20 BAS21
BAS19 / BAS20 / BAS21
Lead-free
SURFACE MOUNT FAST SWITCHING DIODE
Features
· Fast Switching Speed
· Surface Mount Package Ideally Suited for Automatic Insertion
· For General Purpose Switching Applications
· High Conductance
· Lead Free/RoHS Compliant (Note 3)
· Qualified to AEC-Q101 Standards for High Reliability
A
Mechanical Data
BC
· Case: SOT-23
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
TOP VIEW
E
D
G
H
· Terminals: Solderable per MIL-STD-202, Method 208
K
M
· Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
J
L
· Polarity: See Diagram
· BAS19 Marking: KA8, KT3, KT2 (See Page 3)
· BAS20 Marking: KT2, KT3 (See Page 3)
· BAS21 Marking: KT3 (See Page 3)
· Weight: 0.008 grams (approximate)
SOT-23
Dim Min Max
A
0.37 0.51
B
1.20 1.40
C
2.30 2.50
D
0.89 1.03
E
0.45 0.60
G
1.78 2.05
H
2.80 3.00
J 0.013 0.10
K 0.903 1.10
L
0.45 0.61
M 0.085 0.180
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Symbol
Repetitive Peak Reverse Voltage
VRRM
Working Peak Reverse Voltage
DC Blocking Voltage
V_RWM
V_R
RMS Reverse Voltage
V_R(RMS)
Forward Continuous Current (Note 1)
I_FM
Average Rectified Output Current (Note 1)
IO
Non-Repetitive Peak Forward Surge Current @ t = 1.0ms
@ t = 1.0s
IFSM
Repetitive Peak Forward Surge Current (Note 1)
I_FRM
Power Dissipation (Note 1)
Pd
Thermal Resistance Junction to Ambient Air (Note 1)
R_qJA
Operating and Storage Temperature Range
Tj , TSTG
BAS19
120
100
71
BAS20
200
150
106
400
200
2.5
0.5
625
250
500
-65 to +150
BAS21
250
200
141
Unit
V
V
V
mA
mA
A
mA
mW
°C/W
°C
Electrical Characteristics ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Symbol Min
Max
Unit
Reverse Breakdown Voltage (Note 2)
BAS19
120
BAS20 V(BR)R
200
¾
V
BAS21
250
Forward Voltage
V_F
¾
1.0
1.25
V
Reverse Current @ Rated DC Blocking Voltage (Note 2)
I_R
¾
100
nA
15
mA
Total Capacitance
C_T
¾
5.0
pF
Reverse Recovery Time
trr
¾
50
ns
Note:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
DS12004 Rev. 18 - 2
1 of 3
www.diodes.com
Test Condition
I_R = 100mA
I_F = 100mA
IF = 200mA
Tj = 25°C
T_j = 100°C
V_R = 0, f = 1.0MHz
I_F = I_R = 30mA,
I_rr = 0.1 x I_R, R_L = 100W
BAS19 / BAS20 / BAS21
ã Diodes Incorporated