BAS19W_08 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT FAST SWITCHING DIODE

BAS19W - BAS21W
Features
SURFACE MOUNT FAST SWITCHING DIODE
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Mechanical Data
• Fast Switching Speed
• Surface Mount Package Ideally Suited for Automated Insertion
• For General Purpose Switching Applications
• High Conductance
• Lead Free/RoHS Compliant (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 4 and 5)
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
• BAS19W Marking: KA8 or KT2 or KT3 (See Page 2)
• BAS20W Marking: KT2 or KT3 (See Page 2)
• BAS21W Marking: KT3 (See Page 2)
• Weight: 0.006 grams (approximate)
SOT-323
TOP VIEW
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_FM
I_O
I_FSM
I_FRM
TOP VIEW
Internal Schematic
BAS19W
120
100
71
BAS20W
200
150
106
400
200
2.5
0.5
625
BAS21W
Unit
250
V
200
V
141
V
mA
mA
A
mA
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J , T_STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current
@ Rated DC Blocking Voltage (Note 2)
Total Capacitance
Reverse Recovery Time
BAS19W
BAS20W
BAS21W
Symbol Min
120
V_(BR)R
200
250
V_F
⎯
I_R
⎯
C_T
⎯
t_rr
⎯
Max
⎯
⎯
⎯
1.0
1.25
100
15
5.0
50
Unit
Test Condition
V I_R = 100μA
V ^{IF = 100mA}
I_F = 200mA
nA T_J = 25°C
μA T_J = 100°C
pF V_R = 0, f = 1.0MHz
ns ^{IF = IR = 30mA,}
I_rr = 0.1 x I_R, R_L = 100Ω
Notes:
1. Part mounted on FR-4 PC board with minimum recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
BAS19W - BAS21W
Document number: DS30118 Rev. 13 - 2
1 of 3
www.diodes.com
March 2008
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