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BAS116T_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT LOW LEAKAGE DIODE
SPICE MODELS: BAS116T BAW156T BAV170T BAV199T
BAS116T, BAW156T,
Lead-free BAV170T, BAV199T
Features
· Ultra-Small Surface Mount Package
· Very Low Leakage Current
· Lead Free/RoHS Compliant (Note 2)
· Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
· Case: SOT-523
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
K
· Moisture sensitivity: Level 1 per J-STD-020C
· Terminals: Solderable per MIL-STD-202, Method 208
J
· Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
· Polarity: See Diagrams Below
· Marking: See Diagrams Below & Page 3
· Weight: 0.002 grams (approx.)
· Ordering Information: See Page 3
SURFACE MOUNT LOW LEAKAGE DIODE
A
C
TOP VIEW B C
B
E
G
H
N
D
L
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D ¾ ¾ 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
M
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
a 0° 8° ¾
All Dimensions in mm
BAS116T Marking: 50
BAW156T Marking: 53
BAV170T Marking: 51
BAV199T Marking: 52
Maximum Ratings @ TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Single Diode
Double Diode
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0ms
@ t = 1.0ms
@ t = 1.0s
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFRM
IFSM
Pd
RqJA
Tj , TSTG
Value
85
60
215
125
500
4.0
1.0
0.5
150
833
-65 to +150
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
Unit
V
V
mA
mA
A
mW
°C/W
°C
DS30258 Rev. 10 - 2
1 of 3
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BAS116T, BAW156T, BAV170T, BAV199T
ã Diodes Incorporated