BAS116T_09 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT LOW LEAKAGE DIODE

Features
• Ultra-Small Surface Mount Package
• Very Low Leakage Current
• Lead Free/RoHS Compliant (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 3 and 4)
BAS116T, BAW156T,
BAV170T, BAV199T
SURFACE MOUNT LOW LEAKAGE DIODE
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Mechanical Data
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SOT-523
Case: SOT-523
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagrams Below
Marking Information: See Diagrams Below and Page 3
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
Top View
BAS116T Marking: 50
BAW156T Marking: 53
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current
Single Diode
Double Diode
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_FM
I_FRM
I_FSM
BAV170T Marking: 51
Value
85
60
215
125
500
4.0
1.0
0.5
BAV199T Marking: 52
Unit
V
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Reverse Recovery Time
Symbol Min
Typ
Max
Unit
Test Condition
V_(BR)R
85
⎯
⎯
V I_R = 100μA
0.90
I_F = 1.0mA
V_F
⎯
⎯
1.0
1.1
V ^{IF = 10mA}
I_F = 50mA
1.25
I_F = 150mA
I_R
⎯
⎯
5.0
80
nA VR = 75V
nA V_R = 75V, T_j = 150°C
C_T
⎯
2
⎯
pF V_R = 0, f = 1.0MHz
t_rr
⎯
⎯
3.0
μs
I_F = I_R = 10mA,
I_rr = 0.1 x I_R, R_L = 100Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
BAS116T, BAW156T,
BAV170T, BAV199T
Document number: DS30258 Rev. 12 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated