BAS116 Datasheet, PDF (1/3 Pages) NXP Semiconductors – Low-leakage diode

BAS116
Features
SURFACE MOUNT LOW LEAKAGE DIODE
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Mechanical Data
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Solderable per MIL-STD-202, Method
208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
SOT-23
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @T_A = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
V_RWM
85
V
V_R
RMS Reverse Voltage
V_R(RMS)
60
V
Forward Continuous Current (Note 1)
I_FM
215
mA
Repetitive Peak Forward Current
I_FRM
500
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
4.0
@ t = 1.0ms
I_FSM
1.0
A
@ t = 1.0s
0.5
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @T_A = 25°C
Thermal Resistance Junction to Ambient Air (Note 1) @T_A = 25°C
Operating and Storage Temperature Range
Symbol
P_D
R_θJA
T_J, T_STG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min
Typ
Max Unit
Test Condition
V_(BR)R
85
⎯
⎯
V I_R = 100μA
0.90
I_F = 1.0mA
V_F
⎯
⎯
1.0
1.1
V ^{IF = 10mA}
I_F = 50mA
1.25
I_F = 150mA
I_R
⎯
⎯
5.0
80
nA VR = 75V
nA _{VR = 75V, Tj = 150°C}
C_T
⎯
2
⎯
pF V_R = 0, f = 1.0MHz
t_rr
⎯
⎯
3.0
μs
I_F = I_R = 10mA,
I_rr = 0.1 x I_R, R_L = 100Ω
Notes:
1. Part mounted on FR-4 PC board with pad layout as shown on page 3.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃ Fire Retardants.
BAS116
Document number: DS30233 Rev. 9 - 2
1 of 3
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May 2008
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