B520C_ Datasheet, PDF (1/3 Pages) Diodes Incorporated – 5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

SPICE MODELS: B520C B530C B540C B550C B560C
B520C - B560C
5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
· Guard Ring Die Construction for Transient Protection
· Ideally Suited for Automatic Assembly
· Low Power Loss, High Efficiency
· Surge Overload Rating to 175A Peak
· For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
· Lead Free Finish/RoHS Compliant (Note 3)
Mechanical Data
· Case: SMC
· Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208 _e3
· Polarity: Cathode Band or Cathode Notch
· Marking Information: See Page 3
· Ordering Information: See Page 3
· Weight: 0.21 grams (approximate)
B
A
C
D
J
H
G
E
SMC
Dim Min Max
A
5.59 6.22
B
6.60 7.11
C
2.75 3.18
D
0.15 0.31
E
7.75 8.13
G
0.10 0.20
H
0.76 1.52
J
2.00 2.62
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
@ T_A = 25°C unless otherwise specified
Characteristic
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
VRWM
VR
RMS Reverse Voltage
V_R(RMS)
Average Rectified Output Current
@ T_T = 90°C
IO
Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave Superimposed on Rated Load
IFSM
Forward Voltage
@ I_F = 5.0A DC
VFM
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA = 25°C
@ T_A = 100°C
I_RM
Typical Total Capacitance (Note 2)
CT
Thermal Resistance, Junction to Terminal
R_qJT
Thermal Resistance, Junction to Ambient (Note 1)
RqJA
Operating Temperature Range
T_j
Storage Temperature Range
TSTG
B520C
20
14
B530C B540C B550C B560C
30
40
50
60
21
28
5.0
175
0.55
0.5
20
300
10
50
-55 to +125
-55 to +150
35
42
0.70
Notes:
1. Thermal Resistance: Junction to ambient, unit mounted on PC board with 8.0 mm² (0.033 mm thick) copper pads as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
3. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.
Unit
V
V
A
A
V
mA
pF
°C/W
°C/W
°C
°C
DS13012 Rev. 8 - 2
1 of 3
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B520C-B560C
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