B3L30LP_09 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 3A SCHOTTKY BARRIER RECTIFIER

Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• Low Forward Voltage Drop
• For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
• High Forward Surge Current Capability
• Lead Free by Design, RoHS Compliant (Note 1)
• "Green" Device (Note 3)
B3L30LP
3A SCHOTTKY BARRIER RECTIFIER
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Mechanical Data
• Case: DFN3030-8
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish - NiPdAu over Copper lead frame.
Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.0172 grams (approximate)
CCCC
C = CATHODE
A = ANODE
AAAA
Bottom View
BOTTOM VIEW
Schematic and Pin Configuration
Maximum Ratings @T_A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Symbol
V_RRM
V_RWM
V_R
V_R(RMS)
I_O
I_FSM
Value
Unit
30
V
21
V
3.0
A
30
A
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Power Dissipation (Note 5)
(Note 6)
(Note 7)
Operating and Storage Temperature Range
Symbol
R_θJS
R_θJA
P_D
T_J, T_STG
Typ
Max
⎯
3
130
⎯
⎯
2.5
⎯
4.0
⎯
4.5
-65 to +150
Unit
°C/W
°C/W
W
°C
Electrical Characteristics @T_A = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 4)
Forward Voltage
Reverse Current (Note 4)
Symbol
V_(BR)R
V_F
I_R
Min
Typ
Max Unit
Test Condition
30
⎯
⎯
V I_R = 5.0mA
⎯
0.28
⎯
I_F = 0.5A, T_J = 25°C
⎯
0.30 0.35
I_F = 1.0A, T_J = 25°C
⎯
0.18 0.29
I_F = 1.0A, T_J = 125°C
⎯
0.33 0.40
V I_F = 2.0A, T_J = 25°C
⎯
0.22 0.37
I_F = 2.0A, T_J = 125°C
⎯
0.35 0.45
I_F = 3.0A, T_J = 25°C
⎯
0.26 0.42
I_F = 3.0A, T_J = 125°C
⎯
0.27
1.0
mA TJ = 25°C, VR = 30V
⎯
55
90
mA T_J = 100°C, V_R = 30V
Notes:
1. No purposefully added lead.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. T_A = 25°C.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
5. Device mounted on FR-4 PCB, 25mm² pad area.
6. Device mounted on FR-4 PCB, 75mm² pad area.
7. Aluminum PCB with copper mounting pad area of 75mm².
B3L30LP
Document number: DS30915 Rev. 7 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated