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B320_1 Datasheet, PDF (1/3 Pages) Diodes Incorporated – 3.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
SPICE MODELS: B320 B330 B340 B350 B360
B320 - B360
3.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
• Guard Ring Die Construction for Transient Protection
• Ideally Suited for Automatic Assembly
• Low Power Loss, High Efficiency
• Surge Overload Rating to 125A Peak
• For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Application
• Lead Free Finish/RoHS Compliant (Note 4)
Mechanical Data
• Case: SMC
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.21 grams (approximate)
SMC
Dim Min Max
A
5.59 6.22
B
6.60 7.11
C
2.75 3.18
D
0.15 0.31
E
7.75 8.13
G
0.10 0.20
H
0.76 1.52
J
2.00 2.62
All Dimensions in mm
* Note: Device may have a semicircular indentation/notch
on one side of the device (as shown).
Maximum Ratings and Electrical Characteristics @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ TT =100C°
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
IFSM
B320
20
14
B330
30
21
B340
40
28
3.0
125
B350
50
35
B360
60
42
Forward Voltage (Note 3)
Peak Reverse Current
at Rated DC Blocking Voltage (Note 3)
Typical Capacitance (Note 2)
@ IF = 3.0A
VFM
@ TA = 25°C
@ TA = 100°C
IRM
CT
Typical Thermal Resistance, Junction to Terminal
RθJT
Typical Thermal Resistance, Junction to Ambient (Note 1)
RθJA
Operating Temperature Range
Tj
Storage Temperature Range
TSTG
0.50
0.70
0.5
20
200
20
90
-55 to +125
-55 to +150
Notes:
1. Thermal Resistance: Junction to terminal, unit mounted on glass epoxy substrate with 2x3mm copper pad
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Short duration test pulse used to minimize self-heating effect.
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
Unit
V
V
A
A
V
mA
pF
°C/W
°C/W
°C
°C
DS30923 Rev. 2 - 2
1 of 3
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B320-B360
© Diodes Incorporated