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B220 Datasheet, PDF (1/2 Pages) Diodes Incorporated – 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
B220/A - B260/A
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
· Schottky Barrier Chip
· Guard Ring Die Construction for
Transient Protection
· Ideally Suited for Automatic Assembly
· Low Power Loss, High Efficiency
· Surge Overload Rating to 50A Peak
· For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Application
· High Temperature Soldering:
260°C/10 Second at Terminal
· Plastic Material - UL Flammability
Classification 94V-0
Mechanical Data
· Case: Molded Plastic
· Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
· Polarity: Cathode Band or Cathode Notch
· Approx. Weight: SMA 0.064 grams
SMB 0.093 grams
· Mounting Position: Any
· Marking: Type Number
A
J
H
SMA
SMB
B
Dim Min Max Min Max
A 2.29 2.92 3.30 3.94
C
B 4.00 4.60 4.06 4.57
C 1.27 1.63 1.96 2.21
D 0.15 0.31 0.15 0.31
D
E 4.80 5.59 5.00 5.59
G 0.10 0.20 0.10 0.20
H 0.76 1.52 0.76 1.52
G
J 2.01 2.62 2.00 2.62
E
All Dimensions in mm
No Suffix Designates SMB Package
“A” Suffix Designates SMA Package
Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol B220/A B230/A B240/A B250/A B260/A Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
20
30
40
50
60
V
VR
RMS Reverse Voltage
VR(RMS)
14
21
28
35
42
V
Average Rectified Output Current
@ TT = 100°C
IO
2.0
A
Non-Repetitive Peak Forward Surge Current, 8.3ms single
half sine-wave superimposed on rated load
IFSM
50
A
(JEDEC Method)
Forward Voltage
@ IF = 2.0A VFM
0.50
0.70
V
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA = 25°C
@ TA = 100°C
IRM
0.5
20
mA
Typical Junction Capacitance (Note 2)
Cj
200
pF
Typical Thermal Resistance, Junction to Terminal
RqJT
20
K/W
Typical Thermal Resistance, Junction to Ambient (Note 1) RqJA
25
K/W
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
°C
Notes: 1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
DS13004 Rev. E-2
1 of 2
B220/A-B260/A