AP02001 Datasheet, PDF (1/12 Pages) Diodes Incorporated – SUGGESTED PAD LAYOUT

SUGGESTED PAD LAYOUT
Based on IPC-7351A
DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC
C
X
Dimensions
Z
G
X
Y
C
DFN1006-2 /
DFN1006H4-2
1.1
0.3
0.7
0.4
0.7
MiniMELF
4.7
2.1
1.7
1.3
3.5
MELF
6.3
3.3
2.7
1.5
4.8
Y
SOD-123
4.9
2.5
0.7
1.2
3.7
G
Z
SOD-323
3.75
1.05
0.65
1.35
2.40
SOD-523
2.3
1.1
0.8
0.6
1.7
SMA
6.5
1.5
1.7
2.5
4.0
SMB
6.8
1.8
2.3
2.5
4.3
SMC
9.4
4.4
3.3
2.5
6.8
X₁
X ^G2
C
G1
Y
Z
DFN1006-3 / DFN1006H4-3
Dimensions
Z
G1
G2
X
X1
Y
C
Value (in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
C
X1
Y
G1
Z
DFN1411-3
X2
G2 X
Dimensions
Z
G1
G2
X
X1
X2
Y
C
Value (in mm)
1.38
0.15
0.15
0.95
0.75
0.40
0.75
0.76
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 38
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Suggested Pad Layout
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