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2DC4617Q_2 Datasheet, PDF (1/3 Pages) Diodes Incorporated – NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
2DC4617Q/R/S
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Ultra Miniature Surface Mount Package
• Complementary PNP Type Available (2DA1774Q,R,S)
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin annealed over Alloy 42
leadframe).
• Marking Information: (See Page 3): 2DC4617Q: 8D
2DC4617R: 8E
2DC4617S: 8F
• Ordering Information: See Page 3
• Weight: 0.002 grams (approximate)
A
C
BC
B
E
G
H
K
N
J
D
L
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
Pd
RθJA
Tj, TSTG
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D ⎯ ⎯ 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
J 0.00 0.10 0.05
M
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
α 0° 8° ⎯
All Dimensions in mm
Value
60
50
7.0
150
Value
150
833
-55 to +150
Unit
V
V
V
mA
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 2)
DC Current Gain
Collector-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
Current Gain-Bandwidth Product
Current Gain-Bandwidth Product
2DC4617Q
2DC4617R
2DC4617S
Symbol Min Typ Max Unit
Test Condition
V(BR)CBO
60
⎯ ⎯ V IC = 50μA, IE = 0
V(BR)CEO
50
⎯ ⎯ V IC = 1.0mA, IB = 0
V(BR)EBO
7.0
⎯ ⎯ V IE = 50μA, IC = 0
ICBO
⎯
⎯ 100 nA VCB = 60V
IEBO
⎯
⎯ 100 nA VEB = 7.0V
120 ⎯ 270
hFE
180
⎯ 390 ⎯ VCE = 6.0V, IC = 1.0mA
270 ⎯ 560
VCE(SAT)
⎯
⎯ 0.4 V IC = 50mA, IB = 5.0mA
Cobo
fT
fT
fT
⎯
2.0 3.5 pF VCB = 12V, f = 1.0MHz, IE = 0
⎯
180 ⎯ MHz VCE = 12V, IE = -2mA, f = 1MHz
180 Typ.
⎯ MHz VCE = 12V, IE = 0A, f = 1MHz
180 Typ.
⎯
MHz
VCE = 12V, IC = -2.0mA,
f = 100MHz
Notes:
1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30252 Rev. 9 - 2
1 of 3
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