DTC3058_13 Datasheet, PDF (1/8 Pages) DinTek Semiconductor Co,.Ltd – N-Channel 30-V (D-S) MOSFET Halogen-free

N-Channel 30-V (D-S) MOSFET
DTC3058
www.din-tek.jp
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.033 at V_GS = 4.5 V
30
0.045 at V_GS = 2.5 V
I_D (A)^a
6.8
6.8
Q_g (Typ.)
10 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
APPLICATIONS
• Load Switches for Portable Devices
RoHS
COMPLIANT
D
D
GD S
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
6.8^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6^a
6.8 ^{a, b , c}
T_A = 70 °C
6 ^{a, b, c}
A
Pulsed Drain Current
I_DM
30
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
5.2
2.1^{b, c}
T_C = 25 °C
6.3
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
4
2.5^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{a, c, d}
t≤5s
R_thJA
40
Maximum Junction-to-Foot (Drain)
Steady State
R_thJF
15
50
°C/W
20
Notes:
a. Package limited, T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 95 °C/W.
e. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
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