J30XXBA012LX4 Datasheet, PDF (2/2 Pages) Dielectric Laboratories, Inc. – Miniature RF Blocking Network

Miniature RF Blocking Network
Metallization:
Top: 50•/Square TaN, 300Å TiW, 100 • Inch minimum Au.
Bottom: 300Å TiW, 100 • Inch minimum Au.
Screening Options
Test Code
X
Test/Inspection
Bond Strength
IR
Visual Inspection
Pad to pad resistance check
Sample Size
2 Pcs/Plate
1% AQL
100%
1% AQL
Description
2 bonding pads on each sample
2 1/2 times rated voltage of 25 volts
4 Side visual screening
Ensure isolation between segments and boarder
Performance
Segment Bonding for Measurement
Typical Application
For additional data of multi-segment devices please
contact an inside sales representative.
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