S30AG250KY1234 Datasheet, PDF (1/2 Pages) Dielectric Laboratories, Inc. – HEAT SINKS AND STANDOFFS

HEAT SINKS
AND STANDOFFS
Single Layer Aluminum Nitride for use as
Standoffs or Heatsinks.
Part Number
S 30 AG 250 K Y 1234
Product Code
Width Code
Material Code
Thickness Code
Drawing Reference
Code
Surface Finish Code
Thickness Tolerance
Code
Applications
t Laser diode mounts
t HPA MMIC submounts
t Standoffs
Benefits
t High thermal conductivity
t Low capacitance
t Available with AuSn for solder die attach
t 4.6 PPM/°C coefficient of thermal
expansion provides stable match for
GaAs and Si die
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