RLT0816-2-R100F Datasheet, PDF (4/9 Pages) Delta Electronics, Inc. – 1/8W, 0603, Low Resistance Chip Resistor (Lead / Halogen Free)

5-2 Mechanical
Item
Solderability
Resistance to Solder
Heat
Bending Test
Solvent Resistance
Specification and Requirement
Test Method (JIS 5201)
The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder
Solder bath:
After immersing in flux, dip in
245 ± 5℃ molten solder bath for 2 ±
0.5 seconds
△ R: ± 1.0%
(1) Pre-heat: 100~110℃
Without distinct deformation in
appearance
for 30 seconds
(2) Immersed at solder bath of
270 ± 5℃ for 10 ± 1
seconds
(3) Measuring resistance 1
hour after test
△ R: ± 1.0%
Bending value: 3 mm for 30 ± 1
Without mechanical damage such as seconds
break
Without mechanical and distinct (1) Solvent: Trichloroethane
damage in appearance
or Isopropyl alcohol
(2) Immersed in solvent at room
temperature for 300 seconds
UNLESS OTHERWISE SPECIFIED
TOLERANCES ON ﹕
X
=±
X.X = ±
X.XX = ±
ANGLES ± HOLE DIA. ±
DRAWN BY ﹕connie 4/3/13
DESIGNED BY ﹕
CHECKED BY ﹕
APPROVED BY ﹕
SCALE ﹕ X UNIT ﹕ X
TITLE : The Engineering Specification for RLT0816 1/8W
Low Resistance Chip Resistor
台達電子工業股份有限公司
Delta Electronics, Inc.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
SRK320000NH
PAGE
REV.
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