BUDI-5000D-1A Datasheet, PDF (1/1 Pages) DIOTEC Electronics Corporation – 50 AMP JUMBO DIODE CELL

DIOTEC ELECTRONICS CORP
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: [phone] Fax: [phone]
50 AMP JUMBO DIODE CELL
Data Sheet No. BUDI-5000D-1A
FEATURES
MECHANICAL SPECIFICATION
Void Free Vacuum Die Soldering For
Maximum Mechanical Strength and Heat
Dissipation (Solder Voids:
Typical < 2%, Max. < 10% of Die Area)
Biggest Effective Die Area for the 50 Amp
Class of Jumbo Diode Cells
High Temperature Solder (Solidus 287^OC,
Liquidus 296^OC) to Allow Higher Operating
And Assembly Temperatures
Die Size:
0.180" x 0.180"
Square
Smallest Diameter
Slug Is Anode
G
Largest Diameter
Slug Is Cathode
D
A
Proprietary
Passivation
B
F
Silver Plated
Copper Slugs
Silicon Die
Copper Headers Are Silver Plated For
Easy Soldering And Superior Solder Joints
Largest Diameter Header Is Cathode
RoHS COMPLIANT
DIM
A
B
D
F
G
MILLIMETERS
INCHES
MIN
7.25
2.05
6.50
0.72
0.96
MAX
7.35
2.15
6.60
0.82
1.07
MIN
0.285
0.080
0.256
0.028
0.038
MAX
0.290
0.085
0.260
0.032
0.042
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
PARAMETER (TEST CONDITIONS)
SYMBOL
RATINGS
UNITS
Series Number
Maximum DC Blocking Voltage
Maximum RMS Voltage
Maximum Peak Recurrent Reverse Voltage
C^o
Average Forward Rectified Current @ T =125 C
Peak Forward Surge Current (8.3mS single half sine wave
superimposed on rated load)
Maximum Forward Voltage Drop at 50 Amps DC
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
A^o
@ T = 25 C
A^o
@ T = 125 C
Maximum Thermal Resistance, Junction to Case (Note 1)
Junction Operating and Storage Temperature Range
Notes: 1) Single Side Cooled
VRRM
VRMS
VRRM
IO
IFSM
VFM
IRM
RGJC
TJ ,TSTG
BAR BAR BAR BAR BAR BAR BAR
5001D 5002D 5004D 5006D 5008D 5010D 5012D
100
200
400
600
800 1000 1200
70
140
280
420
560
700
840 VOLTS
100
200
400
600
50
600
800
1000 1200
AMPS
1.1 (1.05 Typical)
2
50
0.8
-65 to +175
1.15
VOLTS
mA
°C/W
°C
*)4#@
K15