FSMD014 Datasheet, PDF (1/4 Pages) DB Lectro Inc – Surface Mount PTC FSMD Series

Surface Mount PTC FSMD Series
FUZETEC
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 140mA~1.6A
Maximum Voltage: 6V~60V
Temperature Range: -40
to 85

Agency Approvals: UL(E211981),
C-ULTUV pending
Electrical Characteristics(23)
Part
Number
FSMD014
FSMD020
FSMD035
FSMD050
FSMD075
FSMD110
FSMD160
Hold Trip Rated Max Typical Max Time to Trip
Current Current Voltage Current Power Current Time
IH,A IT,A VMAX,Vdc IMAX, A Pd, W Amp
Sec
0.14 0.30
60
10 0.8
8.0 0.02
0.20 0.40
30
10 0.8
8.0
0.02
0.35 0.70
16
40 0.8
8.0
0.10
0.50 1.00
16
40 0.8
8.0
0.15
0.75 1.50
16
40 0.8
8.0
0.02
1.10 2.20
6
40 0.8
8.0
0.30
1.60 3.20
6
40 0.8
8.0
0.5
Resistance Tolerance
RMIN
Ω
1.50
0.80
0.32
0.15
0.11
0.04
0.03
R1MAX
Ω
6.50
5.00
1.50
1.00
0.45
0.21
0.10
IH=Hold current-maximum current at which the device will not trip at 23
still air.
IT=Trip current-minimum current at which the device will always trip at 23
still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)
I = MAX Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23
still air environment.
RMIN=Minimum device resistance at 23
prior to tripping.
R1MAX=Maximum device resistance at 23
measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
1
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2