DS1615 Datasheet, PDF (22/24 Pages) Dallas Semiconductor – Temperature Recorder

AC ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL MIN
Vcc rise/fall time
Delay from ST to INSPEC or
OUTSPEC Active
Delay from Specification to
INSPEC or OUTSPEC Active
Temperature Conversion Time
INSPEC and OUTSPEC Active
Low Pulse Width
INSPEC and OUTSPEC High
Duration
t_R/t_F
t_SS
t_CS
t_CONV
t_SL
t_SH
DS1615
(-40°C to +85°C; V_CC=5.0V ±10%)
TYP MAX UNITS NOTES
560
ms
560
ms
150
200
ms
62.5
ms
437.5
ms
ASYNCHRONOUS INTERFACE TIMING
PARAMETER
SYMBOL MIN
Date Rate
Turnaround Time
f _BIT
t_TURN
9,408
(-40°C to +85°C; V_CC=5.0V ±10%)
TYP MAX UNITS NOTES
9,600 9,792 bits/sec
2
2/f_BIT
s
SYNCHRONOUS (3-WIRE) SERIAL
INTERFACE TIMING
PARAMETER
SYMBOL
Data to SCLK Setup
SCLK to Data Hold
SCLK to Data Delay
SCLK Low Time
SCLK High Time
SCLK Frequency
SCLK Rise and Fall
RST to SCLK Setup
SCLK to RST Hold
RST Inactive Time
RST to I/O High Z
SCLK to I/O High Z
t_DC
t_CDH
t_CDD
t_CL
t_CH
t_CLK
t_R , t_F
t_CC
t_CCH
t_CWH
t_CDZ
t_CCZ
MIN
50
70
250
250
DC
1
60
1
(-40°C to 85°C; V_CC=5.0V ±10%)
TYP MAX UNITS NOTES
ns
3
ns
3
200
ns
3,4, 5
ns
3
ns
3
MHz
3
2.0
ns
500
µs
3
ns
3
µs
3
70
ns
3, 7
70
sn
3, 7
NOTES:
1. All voltages are referenced to ground,
2. The data rate f_BIT is equal to 1/t_BIT
3. Measured with V_IH= 3.0V or V_IL= 0.0V and 10 ns maximum rise and fall time.
4. Measured at V_OH=2.4V or V_OL=0.4V.
5. Load Capacitance = 50 pF.
6. Thermometer error reflects temperature error as tested during calibration.
7. Sampled with 5 pF load. Not 100% tested.
8. Comsel pin leakage 3=200 µA.
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