DS1631 Datasheet, PDF (19/19 Pages) National Semiconductor (TI) – CMOS Dual Peripheral Drivers

RECOMMENDED POWERCAP MODULE LAND PATTERN
DS1244/DS1244P
PKG
DIM
A
B
C
D
E
INCHES
MIN NOM MAX
— 1.050 —
— 0.826 —
— 0.050 —
— 0.030 —
— 0.112 —
Note: Dallas Semiconductor recommends that PowerCap module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than three
seconds.
To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove the part, apply flux,
heat the lead frame pad until the solder reflows, and use a solder wick to remove solder.
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