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DS2064 Datasheet, PDF (1/9 Pages) Dallas Semiconductor – 8K x 8 Static RAM | |||
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DS2064
DS2064
8K x 8 Static RAM
FEATURES
⢠Low power CMOS design
⢠Standby current
50 nA max at tA = 25°C VCC = 3.0V
100 nA max at tA = 25°C VCC = 5.5V
1 µA max at tA = 60°C VCC = 5.5V
⢠Full operation for VCC = 4.5V to 5.5V
⢠Data Retention Voltage = 5.5V to 2.0V
⢠Access time equals 200 ns at 5.0V
⢠Operating temperature range of â40°C to +85°C
⢠Full static operation
⢠TTL compatible inputs and outputs
⢠Available in 28âpin DIP and 28âpin SOIC packages
⢠Suitable for both battery operated and battery backup
applications
PIN ASSIGNMENT
NC 1
A12 2
28
VCC
27
WE
A7 3
26
CE2
A6 4
25
A8
A5 5
24
A9
A4 6
23
A11
A3 7
22
OE
A2 8
21
A10
A1 9
20
CE1
A0 10
19
DQ7
DQ0 11
18
DQ6
DQ1 12
17
DQ5
DQ2 13
16
DQ4
GND 14
15
DQ3
DS2064â200 28âPIN DIP (600 MIL)
DS2064Sâ200 28âPIN SOIC (330 MIL)
PIN DESCRIPTION
A0âA12
DQ0âDQ7
CE1, CE2
WE
OE
VCC
GND
NC
â Address Inputs
â Data Input/Output
â Chip Enable Inputs
â Write Enable Input
â Output Enable Input
â 5V Power Supply Input
â Ground
â No Connection
DESCRIPTION
The DS2064 is a 65536âbit low power, fully static ran-
dom access memory organized as 8192 words by eight
bits using CMOS technology. The device operates from
a single power supply with a voltage input between 4.5V
and 5.5V. The chip enable inputs (CE1 and CE2) are
used for device selection and can be used in order to
achieve the minimum standby current mode, which fa-
cilitates both battery operate and battery backup appli-
cations. The device provides fast access time of 200 ns
and is most suitable for low power applications where
battery operation or battery backup for nonvolatility are
required. The DS2064 is a JEDECâstandard 8K x 8
SRAM and is pinâcompatible with ROM and EPROM of
similar density.
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