MTD13P03Q8 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – P-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
SOP-8 Dimension
Spec. No. : C107Q8
Issued Date : 2015.12.21
Revised Date :
Page No. : 9/9
Marking:
Device Name
Year Code : Last digit
of Christian year
Month Code : A, B, C,
D, E, F, G, H, J, K, L,
and M represent Jan
thru Dec
D13
P03
Production Lot Serial number:
Rolling from 01 each month
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
DIM
Inches
Min.
Max.
A 0.1850 0.2007
B 0.1496 0.1575
C 0.2283 0.2441
D
0.0500*
E 0.0130 0.0201
F 0.1472 0.1527
Millimeters
Min.
Max.
4.70
5.10
3.80
4.00
5.80
6.20
1.27 *
0.33
0.51
3.74
3.88
DIM
Inches
Min.
Max.
G 0.0531 0.0689
H 0.1889 0.2007
I
0.0019 0.0098
J 0.0157 0.0500
K 0.0067 0.0098
L 0.0531 0.0610
*: Typical
Millimeters
Min.
Max.
1.35
1.75
4.80
5.10
0.05
0.25
0.40
1.27
0.17
0.25
1.35
1.55
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTD13P03Q8
CYStek Product Specification