MTBA5N10V8 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – N-Channel Logic Level Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN3×3 Dimension
Spec. No. : C731V8
Issued Date : 2012.08.24
Revised Date :
Page No. : 9/9
Marking:
DD DD
BA5
Date
N10
Code
S SSG
8-Lead DFN3×3 Plastic Package
CYStek Package Code: V8
DIM
Inches
Min.
Max.
A 0.0276 0.0354
A1 0.0000 0.0197
b 0.0094 0.0138
c 0.0039 0.0079
D 0.1280 0.1339
D1 0.1201 0.1280
D2 0.0945 0.1024
Millimeters
Min.
Max.
0.70
0.90
0.00
0.50
0.24
0.35
0.10
0.20
3.25
3.40
3.05
3.25
2.40
2.60
DIM
Inches
Min.
Max.
E 0.1181 0.1260
E1 0.0531 0.0610
e
0.0256 BSC
H 0.1260 0.1339
L 0.0118 0.0197
L1 0.0039 0.0079
L2
0.0445 REF
*: Typical
Millimeters
Min.
Max.
3.00
3.20
1.35
1.55
0.65 BSC
3.20
3.40
0.30
0.50
0.10
0.20
1.13 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTBA5N10V8
CYStek Product Specification