MTN12N65FP Datasheet, PDF (8/9 Pages) Cystech Electonics Corp. – N-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
TO-220FP (C Forming) Dimension
Marking:
Spec. No. : C802FP
Issued Date : 2010.01.08
Revised Date : 2012.01.13
Page No. : 8/9
Device Name
Date Code
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Gate 2.Drain 3.Source
*Typical
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A
0.169 0.185 4.300 4.700
E
0.583 0.598 14.800 15.200
A1
0.051 REF
1.300 REF
e
0.100*
2.540*
A2 0.110 0.126 2.800 3.200
F
0.106 REF
2.700 REF
A3
0.098 0.114 2.500 2.900
Φ
0.138 REF
3.500 REF
b
0.020 0.030 0.500 0.750
h
0.000 0.012 0.000 0.300
b1 0.043 0.053 1.100 1.350
L
1.102 1.118 28.000 28.400
b2 0.059 0.069 1.500 1.750 L1 0.067 0.075 1.700 1.900
c
0.020 0.030 0.500 0.750 L2 0.075 0.083 1.900 2.100
D
0.392 0.408 9.960 10.360
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
MTN12N65FP
CYStek Product Specification