MTP4835I3 Datasheet, PDF (7/8 Pages) Cystech Electonics Corp. – P-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
TO-251AB Dimension
Spec. No. : C830I3
Issued Date : 2012.11.07
Revised Date :
Page No. : 7/8
Marking:
Product
Name
Date
Code
4835
□□□□
Style: Pin 1.Gate 2.Drain 3.Source
3-Lead TO-251AB Plastic Package
CYStek Package Code: I3
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A 0.2500 0.2618 6.35
6.65
B 0.2047 0.2126 5.20
5.40
C 0.5709 0.5866 14.50 14.90
D 0.0276 0.0354 0.70
0.90
E 0.0199 0.0276 0.50
0.70
F 0.0886 0.0925 2.25
2.35
G 0.0886 0.0925 2.25
2.35
H 0.0169 0.0228 0.43
0.58
DIM
Inches
Min.
Max.
I
0.0866 0.0945
J 0.2126 0.2244
K 0.2992 0.3071
L 0.0453 0.0492
M 0.0169 0.0228
N
0.1181 REF
S
0.1969 REF
T
0.1496 REF
Millimeters
Min.
Max.
2.20
2.40
5.40
5.70
7.60
7.80
1.15
1.25
0.43
0.58
3.00 REF
5.00 REF
3.80 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
MTP4835I3
CYStek Product Specification