LM358P8 Datasheet, PDF (7/7 Pages) Cystech Electonics Corp. – Dual Operational Comparator

DIP-8 Dimension
Spec. No. : C546P8
CYStech Electronics Corp. Issued Date : 2013.03.14
Revised Date :
Page No. : 7/7
Marking:
Date
Code
LM358
□□□□
Device
Name
DIP-8 Plastic Package
CYStek Package Code : P8
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 3.710 4.310 0.146 0.170 D 9.000 9.400 0.354 0.370
A1 0.510
-
0.020
-
E 6.200 6.600 0.244 0.260
A2 3.200 3.600 0.126 0.142 E1 7.320 7.920 0.288 0.312
B 0.380 0.570 0.015 0.022 e
2.540 (BSC)
0.100 (BSC)
B1
1.524 (BSC)
0.060 (BSC)
L 3.000 3.600 0.118 0.142
C 0.204 0.360 0.008 0.014 E2 8.400 9.000 0.331 0.354
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LM358P8
CYStek Product Specification