BU941ZR3 Datasheet, PDF (5/5 Pages) Cystech Electonics Corp. – NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-3P Dimension
Spec. No. : C660R3
Issued Date : 2016.11.02
Revised Date :
Page No. : 5/5
Marking:
4
Date Code
BU941Z
□□
123
3-Lead TO-3P Plastic Package
CYStek Package Code: R3
Style: Pin 1.Base 2.Collector 3.Emitter
4 Collector
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 4.600 5.000 0.181 0.197
A1 1.200 1.600 0.047 0.063
b 0.800 1.200 0.031 0.047
b1 2.800 3.200 0.110 0.126
b2 1.800 2.200 0.071 0.087
c 0.500 0.700 0.020 0.028
c1 1.450 1.650 0.057 0.065
D 15.450 15.850 0.606 0.622
E 13.700 14.100 0.539 0.555
E1
3.200 REF
0.126 REF
E2
3.300 REF
0.130 REF
DIM
Millimeters
Min. Max.
Inches
Min. Max.
E3
13.450 REF
0.530 REF
F1 13.400 13.800 0.528 0.543
F2 9.400 9.800 0.370 0.386
L 39.900 40.300 1.571 1.587
L1 23.200 23.600 0.913 0.929
L2 20.300 20.600 0.799 0.811
Φ 6.900 7.100 0.272 0.280
G 5.150 5.550 0.203 0.219
e
5.450 TYP
0.215 TYP
H
5.000 REF
0.197 REF
h 0.000 0.300 0.000 0.012
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZR3
CYStek Product Specification