BU941ZP3 Datasheet, PDF (5/5 Pages) Cystech Electonics Corp. – NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-247 Dimension
Spec. No. : C660P3
Issued Date : 2008.07.22
Revised Date :2011.01.04
Page No. : 5/5
Marking:
BU941Z
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
3-Lead TO-247 Plastic Package
CYStek Package Code: P3
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.191 0.200 4.850 5.150 E2
0.142 REF
3.600 REF
A1 0.087 0.102 2.200 2.600 L 1.610 1.626 40.900 41.300
b 0.039 0.055 1.000 1.400 L1 0.976 0.988 24.800 25.100
b1 0.110 0.126 2.800 3.200 L2 0.799 0.811 20.300 20.600
b2 0.071 0.087 1.800 2.200 Φ 0.280 0.287 7.100 7.300
c 0.020 0.028 0.500 0.700 e
0.215 REF
5.450 REF
c1 0.075 0.083 1.900 2.100
H
0.235 REF
5.980 REF
D 0.608 0.620 15.450 15.750 h 0.000 0.012 0.000 0.300
E1
0.138 REF
3.500 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZP3
CYStek Product Specification