BU941ZFP Datasheet, PDF (5/5 Pages) Cystech Electonics Corp. – NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-220FP Dimension
Spec. No. : C660FP
Issued Date : 2008.05.20
Revised Date :
Page No. : 5/5
Marking:
BU941Z
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.169 0.185 4.300 4.700 D 0.392 0.408 9.960 10.360
A1
0.051 REF
1.300 REF
E 0.583 0.598 14.800 15.200
A2 0.110 0.126 2.800 3.200 e
0.100 TYP
2.540 TYP
A3 0.098 0.114 2.500 2.900 F
0.106 REF
2.700 REF
b 0.020 0.030 0.500 0.750 Φ
0.138 REF
3.500 REF
b1 0.043 0.053 1.100 1.350 L 1.102 1.118 28.000 28.400
b2 0.059 0.069 1.500 1.750 L1 0.067 0.075 1.700 1.900
c 0.020 0.030 0.500 0.750 L2 0.075 0.083 1.900 2.100
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZFP
CYStek Product Specification