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BU941ZE3 Datasheet, PDF (5/5 Pages) Cystech Electonics Corp. – NPN Epitaxial Planar Transistor
CYStech Electronics Corp.
TO-220 Dimension
Spec. No. : C660E3
Issued Date : 2010.02.03
Revised Date :
Page No. : 5/5
A
D
B
E
Marking:
C
H
I
3
G
2
1
4
P
M
K Date Code
N
O
3-Lead TO-220 Plastic Package
CYStek Package Code: E3
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
DIM
Inches
Min. Max.
A 0.1972 0.2949
B 0.3539 0.3657
C 0.1661 0.1961
D 0.0449 0.0547
E 0.0130 0.0236
G 0.3803 0.4102
H
*0.6398
Millimeters
Min. Max.
5.01 7.49
8.99 9.29
4.22 4.98
1.14 1.39
0.33 0.60
9.66 10.42
*16.25
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
I
*0.1535
*3.90
K 0.0280 0.0378 0.71 0.96
M 0.0441 0.0551 1.12 1.40
N
*0.1000
*2.54
O 0.5000 0.5756 12.70 14.62
P 0.5701 0.6248 14.48 15.87
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZE3
CYStek Product Specification