MB6ST08 Datasheet, PDF (3/3 Pages) Cystech Electonics Corp. – Miniature Glass Passivated Single Phase Surface Mount Bridge Rectifiers

MBST Dimension
CYStech Electronics Corp.
Spec. No. : C769HT
Issued Date : 2014.04.29
Revised Date :
Page No. : 3/ 3
Marking :
XX
□□□□□□
Date Code
Device Name
MBST Plastic Surface
Mounted Package
CYStek Package Code: HT
Type MB05ST08 MB1ST08 MB2ST08 MB4ST08 MB6ST08 MB8ST08 MT10ST08
Marking 05ST08 1ST08 2ST08 4ST08 6ST08 8ST08 10ST08
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min.
Max.
A 0.165 0.181 4.200 4.600 F
-
0.008
-
0.200
B 0.023 0.031 0.600 0.800 G
-
0.275
-
7.000
C 0.177 0.193 4.500 4.900 J 0.006 0.010 0.150 0.250
D 0.049 0.057 1.250 1.450 L
-
0.650
-
1.650
E 0.900 0.106 2.300 2.700 Q 0.024 0.028 0.600 0.700
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MB05ST08 thru MB10ST08
CYStek Product Specification