MB4ST05 Datasheet, PDF (3/3 Pages) Cystech Electonics Corp. – Miniature Glass Passivated Single Phase Surface Mount Bridge Rectifiers

MBST Dimension
CYStech Electronics Corp.
Spec. No. : C769HT
Issued Date : 2014.04.29
Revised Date : 2014.06.06
Page No. : 3/ 3
Marking :
XX
□□□□□
Date Code
Device Name
MBST Plastic Surface
Mounted Package
CYStek Package Code: HT
Type MB05ST05 MB1ST05 MB2ST05 MB4ST05 MB6ST05 MB8ST05 MB10ST05
Marking MB05S MB1S MB2S MB4S MB6S MB8S MB10S
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min.
Max.
A 0.165 0.181 4.200 4.600 F
-
0.008
-
0.200
B 0.023 0.031 0.600 0.800 G
-
0.275
-
7.000
C 0.177 0.193 4.500 4.900 J 0.006 0.010 0.150 0.250
D 0.049 0.057 1.250 1.450 L
-
0.650
-
1.650
E 0.900 0.106 2.300 2.700 Q 0.024 0.028 0.600 0.700
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MB05ST05 thru MB10ST05
CYStek Product Specification