DB106SG Datasheet, PDF (3/3 Pages) Cystech Electonics Corp. – Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers

DBS Dimension
CYStech Electronics Corp.
Spec. No. : C476HB
Issued Date : 2009.08.21
Revised Date : 2011.07.15
Page No. : 3/3
DIM
Inches
Min. Max.
A 0.195 0.205
B 0.040 0.047
C 0.320 0.335
D
45° (typ)
Millimeters
Min. Max.
5.000 5.200
1.020 1.200
8.130 8.510
45° (typ)
DIM
Inches
Min. Max.
F 0.386 0.404
G 0.245 0.255
H 0.009 0.013
J 0.040 0.060
Millimeters
Min.
Max.
9.800 10.300
6.200 6.500
0.220 0.330
1.020 1.530
E 0.120 0.130 3.050 3.300 K 0.003 0.013 0.076 0.330
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead :Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DB101SG thru DB107SG
CYStek Product Specification