MTC5806AQ8 Datasheet, PDF (12/12 Pages) Cystech Electonics Corp. – P-CHANNEL ENHANCEMENT MODE POWER MOSFET

CYStech Electronics Corp.
SOP-8 Dimension
Spec. No. : C407Q8
Issued Date : 2008.12.02
Revised Date : 2012.05.17
Page No. : 12/12
Marking:
Device Name
Date Code
5806SS
□□□□
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
*: Typical
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
1.350 1.750 0.053 0.069
E
3.800 4.000 0.150 0.157
A1 0.100 0.250 0.004 0.010 E1 5.800 6.200 0.228 0.244
A2 1.350 1.550 0.053 0.061
e
*1.270
*0.050
b
0.330 0.510 0.013 0.020
L
0.400 1.270 0.016 0.050
c
0.170 0.250 0.006 0.010
θ
0°
8°
0°
8°
D
4.700 5.100 0.185 0.200
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTC5806AQ8
CYStek Product Specification