EM5103NA Datasheet, PDF (12/12 Pages) Cystech Electonics Corp. – 3A Low Dropout LDO

CYStech Electronics Corp.
DFN3×3-10L Dimension
Marking:
Spec. No. : C554QP
Issued Date : 2010.11.17
Revised Date :
Page No. : 12/12
Device Name
Date Code
10-Lead DFN3×3-10L Plastic
Surface Mounted Package
CYStek Package Code: NA
DIM
Inches
Min.
Max.
A
0.028 0.031
A1 0.000 0.020
A3
0.008*
b
0.007 0.012
D
0.118*
E
0.118*
Millimeters
Min.
Max.
DIM
Inches
Min.
Max.
0.70
0.80
D2 0.087 0.106
0.00
0.50
E2 0.055 0.069
0.20*
e
0.020*
0.18
0.30
L
0.012 0.020
3.0*
K
0.008
-
3.0*
*:Typical
Millimeters
Min.
Max.
2.20
2.70
1.40
1.75
0.50*
0.30
0.50
0.20
-
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
EM5103
CYStek Product Specification