EM5103QP Datasheet, PDF (11/12 Pages) Cystech Electonics Corp. – 3A Low Dropout LDO

CYStech Electronics Corp.
PSOP-8 Dimension
Spec. No. : C554QP
Issued Date : 2010.11.17
Revised Date :
Page No. : 11/12
Marking:
Device Name
Date Code
8-Lead PSOP-8 Plastic
Surface Mounted Package
CYStek Package Code: QP
DIM
Inches
Min.
Max.
A 0.1850 0.2008
B 0.1457 0.1614
C 0.2283 0.2441
D 0.0130 0.0200
E
0.05*
F 0.0472 0.0638
G 0.0032 0.0110
Millimeters
Min.
Max.
4.70
5.10
3.70
4.10
5.80
6.20
0.33
0.51
1.27 *
1.20
1.62
0.08
0.28
DIM
Inches
Min.
Max.
H 0.0157 0.0327
I
0.0075 0.0102
J 0.0098 0.0197
K
0°
8°
M 0.0764 0.0980
N 0.0764 0.0980
*:Typical
Millimeters
Min.
Max.
0.40
0.83
0.19
0.26
0.25
0.50
0°
8°
1.94
2.49
1.94
2.49
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
EM5103
CYStek Product Specification