CSFR10XSF Datasheet, PDF (1/3 Pages) Cystech Electonics Corp. – 1.0Amp. Surface Mount Ultra Fast Recovery Diodes

CYStech Electronics Corp.
1.0Amp. Surface Mount Ultra Fast Recovery Diodes
CSFR10XSF Series
Spec. No. : C339SF
Issued Date : 2003.06.16
Revised Date :2007.08.24
Page No. : 1/3
Features
• For surface mounted applications.
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• High temperature soldering: 250°C/10 seconds at terminals
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, JEDEC SOD-123/Mini SMA.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Packaging: 12mm tape per EIA STD RS-481.
• Weight: 0.04 gram
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Type
Parameter
Symbol CSFR CSFR CSFR CSFR CSFR
101 102 103 104 105
Repetitive peak reverse voltage
VRRM 50 100 200 300 400
Maximum RMS voltage
VRMS 35 70 140 210 280
Maximum DC blocking voltage
VR 50 100 200 300 400
Maximum instantaneous
forward voltage, IF=1A (Note 1)
VF
1
1
1
1.3 1.3
Reverse Recovery Time
trr 50 50 50 50 50
Average forward rectified current
@TA=50℃
IO
1
Peak forward surge current @8.3ms
single half sine wave superimposed IFSM
30
on rated load (JEDEC method)
Maximum DC reverse current
VR=VRRM,TA=25℃(Note 1)
IR
5
VR=VRRM,TA=125℃(Note 1)
150
Maximum thermal resistance,
Junction to ambient
Rth,JA
42 (typ)
Diode junction capacitance (Note 2) CJ
20 (typ)
Storage temperature
Tstg
-55 ~ +150
Operating temperature
TJ
Notes : 1. Pulse test, pulse width=300μsec, 2% duty cycle
2 . f=1MHz and applied 4.0VDC reverse voltage.
-55 ~ +150
CSFR
106
600
420
600
1.7
75
CSFR
107
800
560
800
1.7
75
Units
V
V
V
V
ns
A
A
μA
μA
℃/W
pF
℃
℃
CSFR10XSF
CYStek Product Specification