W185H Datasheet, PDF (8/8 Pages) Cypress Semiconductor – Six Output Peak Reducing EMI Solution

W185
Package Diagram
24-Pin Shrink Small Outline Package (SSOP, 209-mil)
8
E
7
6
321
1.00
1.00 DIA.
1.00
H + 0.20 M E M
5
D/2
E/2
I PP
4
2.36
DIA. PIN
3
2
REV .
DE S CRIPTIO N
00 INITIAL RELEASE PER DCN#A33907.
01 REVISED PER DCN#D20214.
02 REVISED PER DCN#D20760.
03 REVISED PER DCN#D21151.
04 REVISED PER DCN#D22219.
05 REVISED PER DCN#P60056.
b1
WITH LEAD FINISH
1
DA TE OR IG INA TO R
06/13
1991
HJC
11/05
1992
YMK
E
11/08
1993
EBA
04/26
1994
EBA
06/19
1995
EBA
03/19
1996
J.B.C.
D
c
c1
D
N
8.
6
b
BASE METAL
TOP VIEW
BOTTOM VIEW
NOTES:
SECTION G-G 10.
+ 0.12 M T E D S
12-16°
1. MAXIMUM DIE THICKNESS ALLOWABLE IS 0.43mm (.017 INCHES).
2. DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
e
b8
3. "T" IS A REFERENCE DATUM.
C
A
A2
4. "D" & "E" ARE REFERENCE DATUMS AND DO NOT
C
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT
DO INCLUDE MOLD MISMATCH AND ARE MEASURED
-C-
AT THE PARTING LINE, MOLD FLASH OR
-T-
3
0.076 C 7
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
5. DIMENSION IS THE LENGTH OF TERMINAL
FOR SOLDERING TO A SUBSTRATE.
-E-
-D-
A1
SEATING
4
PLANE
SEE
DETAIL "A"
4
6. TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
7. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE.
SIDE VIEW
.235 MIN
END VIEW
8. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
B
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
B
THAN 0.07mm AT LEAST MATERIAL CONDITION.
0° MIN.
9. CONTROLLING DIMENSION: MILLIMETERS.
PARTING LINE
R
G
GAUGE PLANE
10. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25mm FROM LEAD TIPS.
11. THIS PACKAGE OUTLINE DRAWING COMPLIES WITH
JEDEC SPECIFICATION NO. MO-150 FOR THE LEAD COUNTS SHOWN
A
8
C
OC
G
L
5
L1
0.25 BSC
SEATING PLANE
DETAIL 'A'
DECIMAL
XX±
XXX±
XXXX±
MA TE RIAL
ANGULAR
±
FINISH
DO NOT SCALE DRAWING
P RO JEC TION
A PP RO V AL S
DR AW N
M. CHAVEZ
CH ECK E D
M. BANGLOY
E NG 'R
H. BAUTISTA
RE L EA S ED
H.J. CHOI
D ATE
6 /1 3
19 91
6 /1 3
19 91
6 /1 3
19 91
6 /1 3
19 91
An a m In du stria l Co ., LT D. Am kor/A na m P ilip in as, INC.
Se o ul, K ore a
Ma nil a, Ph ili pp ine s
Am kor E le ctron ics
Am kor E le ctr on ics
Ir ving , TX
Cha nd le r, AZ
E X CE LL EN CE IN S EM IC ON DUCTO R
A S SE MB L Y A ND TE ST
TITLE
PACKAGE OUTLINE,
A
5.30mm (.209") BODY, SSOP
S IZ E
D WG . N O.
A1
32289
RE V.
05
S CAL E
SHEET _{1 of 2}
7
6
5
4
3
2
1
8
E
D
C
B
A
8
7
6
5
4
3
2
1
THIS TABLE IN MILLIMETERS
S
Y
COMMON
NOTE
M
B
DIMENSIONS
N
O
VARI-
4
6
D
N
E
O
L
MIN.
NOM.
MAX.
T
E
ATIONS
MIN.
NOM. MAX.
A 1.73
1.86
1.99
AA
6.07
6.20
6.33 14
A1 0.05
0.13
0.21
AB
6.07
6.20
6.33 16
A2 1.68
1.73
1.78
AC
7.07
7.20
7.33 20
b 0.25
-
0.38 8,10
AD
8.07
8.20
8.33 24
b1 0.25
0.30
0.33 10
AE
10.07
10.20
10.33 28
c 0.09
-
0.20 10
AF
10.07
10.20
10.33 30
c1 0.09
0.15
0.16 10
D
SEE VARIATIONS
4
D
E 5.20
5.30
5.38
4
e
0.65 BSC
H 7.65
L 0.63
7.80
0.75
7.90
0.95
5
VARIATION AF
L1
1.25 REF.
N
SEE VARIATIONS
6
IS DESIGNED BUT NOT TOOLED
OC 0°
4°
8°
R 0.09 0.15
C
THIS TABLE IN INCHES
S
Y
COMMON
NOTE
M
B
DIMENSIONS
N
O
VARI-
O
L
MIN.
NOM.
MAX.
T
E
ATIONS
MIN.
4
D
NOM.
6
N
MAX.
A .068
.073
.0 78
AA
.239
.244
.249 14
A1 .002
.005
.0 08
AB
.239
.244
.249 16
A2 .066
.068
.0 70
AC
.278
.284
.289 20
b .010
-
.015 8,10
AD
.318
.323
.328 24
B
b1 .010
.012
.013 10
AE
.397
.402
.407 28
c .004
-
.008 10
AF
.397
.402
.407 30
c1 .004
.006
.006 10
D
SEE VARIATIONS
4
E .205
.209
.2 12
4
e
.0256 BSC
H .301
.307
.3 11
L .025
.030
.0 37
5
L1
.049 REF.
N
SEE VARIATIONS
6
C
O
0°
4°
8°
R .004 .006
TI TLE
PACKAGE OUTLINE,
5.30mm (.209") BODY, SSOP
S IZE
A1
DWG. NO.
32289
A
REV.
05
8/1 ^SCALE
S HEE T
2 of 2
7
6
5
4
3
2
1
© Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
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