CY7C64013C Datasheet, PDF (50/51 Pages) Cypress Semiconductor – Full-Speed USB (12-Mbps) Function

26.0 Package Diagrams (continued)
28-Lead (300-Mil) Molded SOIC
CY7C64013C
CY7C64113C
PIN 1 ID
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
14
1
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
0.291[7.39]
0.300[7.62]
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
0.394[10.01] ^*
0.419[10.64]
MIN.
MAX.
15
28
0.026[0.66]
0.032[0.81]
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.697[17.70]
0.713[18.11]
SEATING PLANE
0.050[1.27]
TYP.
0.013[0.33]
0.019[0.48]
0.092[2.33]
0.105[2.67]
0.004[0.10] *
0.0118[0.30]
0.004[0.10]
0.015[0.38]
0.050[1.27]
0.0091[0.23] ^*
0.0125[3.17]
51-85026-*D
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-08001 Rev. *B
Page 50 of 51
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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