S6E1B8 Datasheet, PDF (48/128 Pages) Cypress Semiconductor – 32-bit ARM® Cortex®-M0+ FM0+ Microcontroller

PRELIMINARY
S6E1B8 Series
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed
or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections
caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has established a ranking of
mounting conditions for each product. Users are advised to mount packages in accordance with Spansion ranking of recommended
conditions.
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength
may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of
moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing
moisture resistance and causing packages to crack. To prevent, do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product.
Store products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5 ˚C
and 30 ˚C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
(3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica
gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion recommended
conditions for baking.
Condition: 125°C/24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions:
(1) Maintain relative humidity in the working environment between 40% and 70%.
Use of an apparatus for ion generation may be needed to remove electricity.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1
MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is
recommended.
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
Document Number: 001-99223 Rev.**
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