CY8C21634B Datasheet, PDF (35/47 Pages) Cypress Semiconductor – PSoC Programmable System-on-Chip Low power at high speed

CY8C21634B, CY8C21534B, CY8C21434B
CY8C21334B, CY8C21234B
Figure 19. 32-Pin (5 × 5 × 0.4 mm) QFN (Sawn 1.85 × 2.85) EPAD
0.064
-0.090
0.500
0.25±0.040
0.10 MIN
TOP VIEW
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED PAD.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. REFERENCE JEDEC #: MO-220
4. MAXIMUM ALLOWABLE METAL IS 0.0508mm
5. PACKAGE WEIGHT: 0.029 grams
BARE COOPER
0.064
0.127
BOTTOM VIEW
0.300 MIN
0.400
001-44368 *B
Figure 20. 32-Pin Thin Sawn QFN Package
001-48913 *B
Important Note For information on the preferred dimensions for mounting QFN packages, see the Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.
Document Number: 001-67345 Rev. *A
Page 35 of 47
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